On March 6, the Chinese semiconductor circle witnessed a significant "collective declaration." On the latest issue of the journal "Science & Technology Outlook" published on February 13, 2026, core figures from nine top universities and leading enterprises, including Peking University, Tsinghua University, and Yangtze Memory Technologies, jointly published a groundbreaking paper titled "Building an Independent and Controllable Integrated Circuit Industry System." The paper directly pointed out that, in the current context of global technological competition, achieving self-reliance in the chip industry has shifted from a "choice question" to an "essential question" concerning national development and security.

  The author group of this paper can be considered the "strongest think tank" in China's semiconductor field, including academician Wang Yangyuan from the Chinese Academy of Sciences, Professor Wei Shaojun from Tsinghua University, Chen Nanxiang, chairman of Yangtze Memory Technologies, and Zhao Jinrong, former CEO of SMIC. In the paper, they not only systematically reviewed the current status and core bottlenecks of China's integrated circuit industry but also set three hard-core goals for the "14th Five-Year Plan" period (2026-2030): comprehensively solidifying the independent capability of the entire 28nm industry chain, achieving stable mass production of 14nm process technology, and initially building a fully domestic 7nm production line and entering the trial operation stage.

  What is most eye-catching about the paper is that it, for the first time, clearly calls for: mobilizing the whole country to build a Chinese version of ASML. The article states that lithography machines, high-end EDA software, special materials, and other core equipment and technologies are currently the most prominent "bottleneck" issues in China's chip industry. To break foreign monopolies, it is necessary to abandon the previous "single-point breakthrough" approach and shift to "systematic operations," by means of national top-level design, industrial capital coordination, and joint efforts between universities and research institutions, concentrating resources to overcome these "hard bones" and fundamentally eliminate the "bottleneck" risks.

  The paper also clearly points out that there are still problems such as "small, scattered, and weak" in the domestic semiconductor industry, homogenized internal competition, and high dependence on key links abroad. Over the next five years, it must shift from "scale expansion" to "quality improvement," and from "scattered competition" to "coordinated innovation," transforming technical breakthroughs into real industrial advantages and building a safe, independent, and efficient modern integrated circuit industry system.

  Currently, key chips in China's national security sector have achieved 100% self-reliance. Yangtze Memory Technologies and Longchip Memory Technologies are steadily ranked among the global leaders in the memory chip market, and SMIC's mature process capacity continues to expand. With the release of this "collective declaration," China's chip industry is moving from single-point breakthroughs to a new era of full-chain self-reliance and control.

Can China produce its own ASML? When will 7nm fully domesticization come? Share your views in the comments section.

Original: toutiao.com/article/7614008526851932712/

Statement: This article represents the personal views of the author.