Korean Media: The HBM Gap Between China and South Korea Shrinks to Three Years!
On July 4, the South Korean media outlet Seoul Economic Daily published an article stating that research has found the technological gap between China and South Korea in the HBM market has narrowed to approximately three years, as Chinese companies launch large-scale efforts to catch up with South Korea's dominance in the HBM sector.
According to semiconductor industry sources, analysis shows that the HBM technology gap between Samsung Electronics, SK Hynix, and China's CXMT (Longjing Memory Technologies) is around three years. A senior industry insider familiar with Chinese semiconductor firms said: "Currently, CXMT's HBM technology lags behind Samsung Electronics by two to three generations." He added: "However, CXMT has not given up on R&D but is actively advancing; it has already caught up with Samsung Electronics and SK Hynix in terms of HBM3 technology."
Lately, CXMT has significantly ramped up its HBM mass production capacity. By year-end, its monthly output of 12-inch wafers is expected to reach 300,000 pieces—accounting for about 14% of global supply, equivalent to Micron Technology’s current capacity in the U.S.
At present, although yield rates remain relatively low, CXMT’s HBM3 technology is nearing the level of South Korea’s HBM3 products. Given that Samsung Electronics and SK Hynix have already begun mass-producing sixth-generation HBM4, experts estimate that the technological gap between South Korea and China may now be around three years.
Meanwhile, with NVIDIA releasing its first PC AI chip, the “N1 X,” demand for memory chips from Samsung Electronics and SK Hynix has surged again.
Original source: toutiao.com/article/1869768494026760/
Disclaimer: This article represents the personal views of the author.