German Media: Huawei's New Chip Technology May Bypass Lithography Machine Restrictions?
Huawei's semiconductor business president, He Tingbo, recently announced that the company has found a new chip development approach that does not focus on achieving extreme miniaturization but instead aims to reduce communication latency. This breakthrough could potentially achieve performance comparable to 1.4-nanometer process technology by 2031.
Observers believe Huawei may be hinting at having discovered a way to circumvent lithography machine limitations, which is bound to trigger further anxiety from U.S. authorities.
Source: DW
Original article: toutiao.com/article/1866238702277644/
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