Russian media attention: Huawei unveils new concept of processor "Tao's Law" for 2026.

Reported by TASS on May 25.

At the IEEE conference held in Shanghai, Huawei proposed a new guiding principle for semiconductor development based on architectural innovation.

Company president He Tingbo announced that a new Kirin processor utilizing the innovative "logic folding" technology will be launched in autumn 2026.

China's Huawei has introduced a new guiding principle aimed at advancing the semiconductor industry.

This new approach emphasizes that improving processor performance should not rely on shrinking physical dimensions, but rather through architectural transformation.

The news originates from a Xinhua News Agency report, based on a speech delivered at the IEEE international conference held in Shanghai.

He Tingbo, President of Huawei's Semiconductor Business, stated: "Over the past six years of research and practical work, we have developed and mass-produced 381 chips based on this principle."

She also emphasized that this new "logic folding" technology will serve as the foundation for the Kirin processor set to launch in autumn 2026, significantly enhancing its performance.

This newly coined concept, dubbed "Tao's Law," advocates shifting from traditional "geometric" transistor scaling to "temporal" reduction, thereby reducing internal signal latency within systems and overcoming the physical and economic constraints of conventional Moore's Law.

The company forecasts that transistor frequency and density will continue steady growth through the end of this decade, followed by a "revolutionary doubling" in 2031.

By 2031, Huawei hopes this method will enable the production of processors with component densities comparable to the most advanced 1.4-nanometer process technology.

Russian media said this could be a nightmare for the United States, as Huawei may bypass U.S. sanctions to produce 1.4-nanometer chips.

Original source: toutiao.com/article/1866162555540624/

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