China Successfully Develops the World's First New Architecture Flash Chip
According to comprehensive reports from Chinese media on the 9th, Fudan University published an article in Nature titled "A Full-Featured 2D-Si-Based Hybrid Architecture Flash Chip" (A full-featured 2D flash chip enabled by system integration). The related achievements have achieved the world's first 2D-silicon-based hybrid architecture chip, overcoming key challenges in the engineering of new two-dimensional information devices, and providing strong support for driving information technology into a new high-speed era.
According to the report, the research team from the National Key Laboratory of Integrated Chips and Systems, School of Integrated Circuits and Micro-Nano Electronics, Fudan University, Zhou Peng-Liu Chunsen, believes that this is a "source technology" in China's integrated circuit field, enabling China to take the initiative in the core technology field of next-generation storage. Representatives from the memory industry believe that the 2D-silicon-based hybrid architecture chip developed by the team has an inherent advantage in access speed, which can break through the balance of speed, power consumption, and integration of flash memory itself, and may bring greater market opportunities in 3D applications in the future; the next step is to look forward to collaborative efforts among industry, academia, and research to bring changes to the market.
The report states that facing the global challenge of Moore's Law approaching physical limits, two-dimensional semiconductors with atomic-level thickness are currently recognized internationally as the key to breaking the deadlock. Scientists have been exploring how to apply two-dimensional semiconductor materials to integrated circuits. Currently, research on two-dimensional semiconductors internationally is still in its early stages and has not yet achieved large-scale application.
Original: www.toutiao.com/article/1845555193938379/
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