Foreign media: A research team from Peking University has developed an innovative method that uses electron microscopy technology to accurately measure heat flow at the atomic scale at material interfaces, solving the problem of measuring thermal resistance at the nanoscale.
This discovery can help improve the heat dissipation efficiency of chips and promote the development of quantum devices, batteries, and nanosensors.
The research was published in the journal Nature.
Original article: https://www.toutiao.com/article/1835598947050499/
Disclaimer: The article only represents the author's个人观点.