The Times of India and CNBC website reported on January 23 and 27, respectively. On January 27, Ashwini Vaishnaw, Minister of Electronics and Information Technology (MeitY) of India, announced the "India Semiconductor 2.0 Roadmap" at the World Economic Forum in Davos, declaring that India aims to achieve global leadership in semiconductor design and artificial intelligence services. The "Semiconductor 2.0" focuses on six core areas, including computing systems and microcontrollers, radio frequency technology, cybersecurity networks, power management, sensors, and memory. One of its goals is to achieve indigenous production of 3-nanometer chips by 2032. Vaishnaw also announced the "Design Linked Incentive Program 2.0" (DLI 2.0), which will be an important component of "Semiconductor 2.0." He emphasized that after establishing technological advantages in these areas, India will have the capability to design chips for various products such as drones, automobiles, and aerospace technologies. Vaishnaw further stated that India's IT industry is in a critical transformation phase and that India is expected to gradually develop into a major hub for global semiconductor design talent. He predicted that about 50% of global semiconductor design work will be completed in India in the future. India's IT industry is undergoing significant transformation, and India is expected to gradually become a global center for semiconductor design talent. He predicted that about 50% of global semiconductor design work will be completed in India in the future. In terms of industrial progress, Vaishnaw revealed that four semiconductor factories have entered the trial production phase, with one planned to start full-scale commercial operations in the third week of February. Additionally, Micron Technology's $2.75 billion (27.5 billion) semiconductor facility in Sankheda, Gujarat, is expected to achieve commercial production by the end of February.
Original: toutiao.com/article/1855607146721289/
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