Huawei announces technological breakthrough, reducing reliance on high-bandwidth memory chips

Foreign Media: Huawei to Launch Technological Breakthrough, Reducing China's Dependence on High-Bandwidth Memory (HBM) Chips

Huawei plans to announce a technological breakthrough in collaboration with China UnionPay at the 2025 Financial AI Inference Application Forum held in Shanghai, China. This initiative aims to reduce China's reliance on HBM chips when running artificial intelligence inference models and promote the development of AI applications in the financial sector.

If confirmed, this technology will be an important advancement for Huawei in promoting China's self-reliance in AI hardware.

Currently, the main suppliers of HBM chips are Micron and AMD from the United States, as well as Samsung and SK Hynix from South Korea. Although China's Yangtze Memory Technologies and ChangXin Memory Technologies have made progress, they still lag behind their American and South Korean competitors in terms of production capacity and technical maturity.

Original: www.toutiao.com/article/1840232259034115/

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