Source: Guangming Daily
In the era of next-generation wireless communication (6G), high-speed data transmission and fast access are needed in both dense urban areas and remote mountainous regions. However, traditional wireless devices based solely on electronic technology have limited bandwidth and a single frequency band, making it difficult to dynamically schedule spectrum resources.
Professor Wang Xingjun from Peking University and Researcher Shu Haowen, along with Professor Wang Cheng from City University of Hong Kong, announced their research findings online in Nature on the evening of the 27th. They have developed the world's first adaptive full-bandwidth high-speed wireless communication chip based on optoelectronic integration technology, laying a revolutionary hardware foundation for the practical application of 6G communication technology.
A chip the size of a fingernail can efficiently manage the entire frequency spectrum, from microwaves, Sub 6 GHz to millimeter waves and even terahertz, transmitting data at over 120 Gbps, completely breaking the stalemate of "one frequency band, one device" in traditional electronic components.
"We are currently entering an era of everything connected. In the future, 6G networks will not only support applications that are extremely sensitive to bandwidth and latency, such as virtual reality and smart factories, but also achieve wide-area coverage in complex environments like densely populated remote mountains, deep sea, and space," said Wang Xingjun. Different frequency bands each have their own advantages and disadvantages: high-frequency bands have abundant data resources and extremely high speed, but are difficult to transmit over long distances; low-frequency bands have strong penetration and broad coverage, but limited capacity. Traditional wireless devices based solely on electronic technology are limited by materials and structures, often working "fixed" within a single frequency band, leading to complex systems, redundant equipment, and difficulty in dynamically scheduling spectrum resources. Truly achieving "full-bandwidth adaptive utilization" has always been a core challenge facing the industry and academia.
The research team cleverly chose the path of optoelectronic integration. They used advanced thin-film lithium niobate photonic materials to propose a new architecture called "ultra-wideband optoelectronic integrated wireless transceiver engine." The key breakthrough of this chip is the realization of an on-chip integrated optoelectronic oscillator (OEO) with widely, rapidly, and accurately reconfigurable frequencies.
In actual testing, the system demonstrated remarkable performance consistency: the communication quality was smooth and stable throughout the full band, with no attenuation in the high-end frequency band, and a transmission rate of more than 120 Gbps has fully met the peak index requirements of 6G communication. "This also represents another crucial step toward the practical application of terahertz communication. Moreover, the chip demonstrates powerful 'environmental intelligence': when a certain frequency band is interfered with or blocked, the system can automatically switch to a clear frequency band in real-time, like an experienced 'driver' changing lanes in crowded spectrum, always maintaining seamless communication," said Wang Cheng.
"The significance of this technology goes beyond high-speed transmission itself. This full-bandwidth reconfiguration solution will give rise to more flexible and intelligent AI wireless networks, and is expected to reshape the future of wireless communication," revealed Wang Xingjun. It is the first time that a hardware foundation has been laid for a truly 'AI-native network'—which can dynamically adjust communication parameters through built-in algorithms to cope with complex electromagnetic environments. It is also an ideal carrier for integrated communication-sensing systems, allowing future base stations and vehicle-mounted devices to accurately perceive their surroundings while transmitting data, truly realizing 'communication as perception.' From an industrial perspective, this breakthrough will strongly drive upgrades in key components such as wide-band antennas and optoelectronic integration modules, bringing a full-chain transformation from materials, devices, to complete machines and networks."
In the next step, the team will advance the monolithic integration of laser, optoelectronic detectors, and antennas, aiming to develop an intelligent communication module that is "plug-and-play" like a USB drive, capable of being embedded in any terminal, from mobile phones, mobile base stations to drones and IoT devices. "We hope this research can become a technological engine for the next generation of wireless communication technology revolution, driving coordinated innovation and leapfrog development across the entire industry ecosystem," said Wang Xingjun.
(Guangming Daily Full Media Reporter Jin Haotian)
Original: https://www.toutiao.com/article/7543428762654884403/
Statement: This article represents the views of the author. Please express your opinion by clicking the [top/down] buttons below.