U.S. and Taiwanese Companies Collaborate to Bring Chip Manufacturing Back Home

The U.S. Department of State: The U.S. is working with Taiwanese companies TSMC and Foxconn to shift chip production to the U.S.

U.S. Deputy Secretary of State Jacob Helberg said on Tuesday that Washington is collaborating with Taiwanese companies TSMC and Foxconn to move part of semiconductor production to the U.S.

Helberg pointed out during a hearing before the U.S. House Committee on Foreign Affairs: "We are working together with our partners in Taiwan, including TSMC and other companies such as Foxconn, with the aim of bringing semiconductor manufacturing back to the U.S."

According to him, U.S. Commerce Secretary Howard Lutnick facilitated a $250 billion deal, which includes moving about 40% of Taiwan's chip production capacity to the U.S. mainland.

The U.S. deputy secretary added that Washington is striving to strengthen supply chains at all levels - from the mining and processing of critical minerals to semiconductor production.

Original article: toutiao.com/article/1858057495416844/

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