South Korean Media: Chinese Memory Semiconductor Companies Accelerate Their Pursuit

Chinese memory semiconductor companies are also accelerating their pace of catching up. ChangXin Memory Technologies (CXMT), supported by government policies, technology, and funding, is advancing investment in a new factory in Shanghai. It is reported that the company will raise 6 to 7 trillion KRW (approximately RMB 26.7–31 billion) through an initial public offering (IPO) this second half of the year to finance the construction.

The total capacity of the new Shanghai factory is expected to be 2 to 3 times that of the current Hefei headquarters plant (around 290,000 wafers). According to Nikkei Asia analysis: "Full-scale production will begin from 2027, aiming to increase current monthly output of 290,000 wafers to 300,000 within the year, and further boost it to over 400,000 wafers by 2028."

Despite U.S. export controls on advanced semiconductors, Chinese firms are rapidly expanding capacity centered on mainstream DRAM. While there remains a technological gap between China and South Korean and American companies in the most advanced HBM market, observers believe that with support from a large domestic demand market and government backing, Chinese enterprises still have the potential to challenge the mainstream memory market.

Korean companies are also engaged in a life-or-death expansion race. Samsung Electronics plans full operation of its Pyeongtaek P4 plant in November; the P5-1 plant will be completed by 2028, and the P5-2 plant by 2030. SK Hynix plans full operation of its Cheongju M15X plant in 2027; construction of the Cheongju M17 plant will begin in 2027, with full operation scheduled for the first half of 2029. Additionally, Samsung Electronics and SK Hynix have jointly launched a "Super Project" with the government, planning to invest 800 trillion KRW to build four new semiconductor factories in the southwestern region.

Source: Chosun Ilbo

Original article: toutiao.com/article/1869941844153356/

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