China Breaks Through the Lithography Photoresist Technology Bottleneck, Challenging the US-Japan Supply Chain Structure

Foreign Media: China Accurately Breaks Through the Photomask Resin Bottleneck, Aiming to Challenge US and Japanese Monopolies

In the strategy of semiconductor self-reliance, China is shifting its focus from generalized goals to key "neck-bottleneck" materials. Photomask resin has become the new main direction of attack. Photomask resin is a core photosensitive chemical used in the lithography process to etch microcircuit patterns onto silicon wafers. The market is currently highly dependent on suppliers from the United States and Japan.

Photomask resin is divided into types based on the exposure wavelength, including broadband UV, G-line, I-line, KrF, ArF, EUV, and electron beam. Among these, KrF, ArF, and EUV are required for the most advanced processes, with the highest technical barriers, and are also the weakest link in China at present.

Original article: toutiao.com/article/1859814369210375/

Statement: This article represents the personal views of the author.