LG Electronics develops early versions of HBM hybrid bonding stacking equipment
Source: Global Times
[Global Times Tech Comprehensive Report] January 13th, news - According to TheElec, LG Electronics is developing an early version of a hybrid bonding stacking device (bonding machine) for high-bandwidth memory (HBM).
The project has received support from multiple parties, with Justem also participating in it, responsible for developing the system of the kit. The LG Electronics Production Engineering Research Institute (PRI) officially launched the project in June last year.
Currently, the project has produced an internal test prototype alpha version. According to sources, the project was in the concept validation stage at that time, and the team was systematically carrying out various testing work. Among them, the testing of the hybrid bonding process was one of the focuses, and the team conducted relevant tests using modules and bonding heads, aiming to optimize the process and ensure the equipment's performance meets expectations.
The report also said that the project is planned to be completed by 2029, with the target precision set at 200 nanometers. However, this precision specification lags behind Besi Company's commercially available 100-nanometer precision. According to sources, due to this precision difference, when the bonding machine is launched three years later, it may lack competitiveness in the HBM field. (Qingshan)
Original article: toutiao.com/article/1854190052865035/
Statement: This article represents the views of the author.